Zacks Investment Research Upgrades Chipmos Technologies (IMOS) to “Hold”

Chipmos Technologies (NASDAQ:IMOS) was upgraded by Zacks Investment Research from a “sell” rating to a “hold” rating in a report issued on Tuesday.

According to Zacks, “ChipMOS TECHNOLOGIES INC. is a semiconductor service company. It provides testing services for liquid crystal display drivers, high density memory and mixed-signal semiconductors. The company operates primarily in Taiwan, Singapore, the United States, Japan, Korea, Hong Kong and other countries. ChipMOS TECHNOLOGIES INC., formerly known as ChipMOS TECHNOLOGIES LTD., is headquartered in Taiwan. “

Separately, ValuEngine lowered Chipmos Technologies from a “buy” rating to a “hold” rating in a research report on Tuesday, November 14th.

Chipmos Technologies (NASDAQ IMOS) opened at $17.80 on Tuesday. The company has a current ratio of 2.38, a quick ratio of 2.08 and a debt-to-equity ratio of 0.47. Chipmos Technologies has a 12-month low of $13.94 and a 12-month high of $21.99. The firm has a market capitalization of $789.50, a P/E ratio of 14.63, a PEG ratio of 1.82 and a beta of 0.18.

Institutional investors have recently made changes to their positions in the stock. Group One Trading L.P. bought a new stake in Chipmos Technologies during the second quarter worth $113,000. Parametric Portfolio Associates LLC bought a new stake in Chipmos Technologies during the second quarter worth $209,000. Airain ltd bought a new stake in Chipmos Technologies during the second quarter worth $242,000. FDx Advisors Inc. bought a new stake in Chipmos Technologies during the third quarter worth $248,000. Finally, Virtu KCG Holdings LLC bought a new stake in Chipmos Technologies during the second quarter worth $370,000. Institutional investors and hedge funds own 16.47% of the company’s stock.

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Chipmos Technologies Company Profile

ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services, among others.

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