Wall Street analysts expect that Electro Scientific Industries, Inc. (NASDAQ:ESIO) will post $0.29 earnings per share (EPS) for the current quarter, according to Zacks Investment Research. Two analysts have issued estimates for Electro Scientific Industries’ earnings, with the lowest EPS estimate coming in at $0.23 and the highest estimate coming in at $0.35. Electro Scientific Industries posted earnings of $0.99 per share in the same quarter last year, which would suggest a negative year-over-year growth rate of 70.7%. The firm is scheduled to report its next earnings results on Wednesday, January 30th.
According to Zacks, analysts expect that Electro Scientific Industries will report full-year earnings of $2.16 per share for the current financial year, with EPS estimates ranging from $2.09 to $2.22. For the next fiscal year, analysts forecast that the business will report earnings of $2.61 per share, with EPS estimates ranging from $2.32 to $2.90. Zacks Investment Research’s earnings per share averages are a mean average based on a survey of research firms that that provide coverage for Electro Scientific Industries.
Electro Scientific Industries (NASDAQ:ESIO) last posted its quarterly earnings data on Tuesday, October 30th. The semiconductor company reported $0.59 EPS for the quarter, topping analysts’ consensus estimates of $0.57 by $0.02. The company had revenue of $85.92 million for the quarter, compared to analyst estimates of $84.35 million. Electro Scientific Industries had a return on equity of 45.60% and a net margin of 37.32%. The business’s revenue was up 21.1% on a year-over-year basis. During the same quarter in the previous year, the firm earned $0.39 earnings per share.
Electro Scientific Industries stock traded up $0.27 on Friday, reaching $29.40. The company’s stock had a trading volume of 1,050,770 shares, compared to its average volume of 880,785. The company has a debt-to-equity ratio of 0.04, a quick ratio of 4.16 and a current ratio of 5.67. The firm has a market cap of $999.06 million, a P/E ratio of 10.97, a P/E/G ratio of 1.21 and a beta of -0.01. Electro Scientific Industries has a twelve month low of $13.92 and a twelve month high of $29.62.
Several institutional investors and hedge funds have recently modified their holdings of ESIO. UBS Group AG lifted its stake in Electro Scientific Industries by 412.2% in the first quarter. UBS Group AG now owns 34,182 shares of the semiconductor company’s stock worth $661,000 after acquiring an additional 27,508 shares during the last quarter. Principal Financial Group Inc. lifted its position in shares of Electro Scientific Industries by 3.0% during the 1st quarter. Principal Financial Group Inc. now owns 258,248 shares of the semiconductor company’s stock worth $4,992,000 after buying an additional 7,628 shares during the last quarter. Bank of Montreal Can purchased a new stake in shares of Electro Scientific Industries during the 2nd quarter worth approximately $624,000. Acadian Asset Management LLC purchased a new stake in shares of Electro Scientific Industries during the 2nd quarter worth approximately $2,526,000. Finally, Eqis Capital Management Inc. lifted its position in shares of Electro Scientific Industries by 164.5% during the 2nd quarter. Eqis Capital Management Inc. now owns 27,902 shares of the semiconductor company’s stock worth $440,000 after buying an additional 17,353 shares during the last quarter. 91.21% of the stock is currently owned by institutional investors and hedge funds.
Electro Scientific Industries Company Profile
Electro Scientific Industries, Inc, together with its subsidiaries, supplies laser-based microfabrication solutions for the microtechnology industry worldwide. The company provides printed circuit board laser drilling products, including laser via drilling systems for electrical interconnect applications that require dimensions to create electrical connections between layers in flexible circuits, high-density circuit boards, and interconnect packages; micro via drilling technology that addresses the changing applications in interconnect packages, multichip modules, and high density interconnect circuit boards; and ultraviolet laser processing systems that employ technology in lasers, optics, and motion control.
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