Electro Scientific Industries (ESIO) Hits New 52-Week High at $29.62

Electro Scientific Industries, Inc. (NASDAQ:ESIO)’s share price hit a new 52-week high on Monday . The company traded as high as $29.62 and last traded at $29.49, with a volume of 25955 shares. The stock had previously closed at $29.40.

ESIO has been the topic of a number of research analyst reports. ValuEngine upgraded Electro Scientific Industries from a “hold” rating to a “buy” rating in a research note on Wednesday, October 31st. Stifel Nicolaus downgraded Electro Scientific Industries from a “buy” rating to a “hold” rating and set a $30.00 target price on the stock. in a research note on Tuesday, October 30th. Lake Street Capital downgraded Electro Scientific Industries from a “buy” rating to a “hold” rating in a research note on Tuesday, October 30th. BidaskClub upgraded Electro Scientific Industries from a “sell” rating to a “hold” rating in a research note on Thursday, August 9th. Finally, Needham & Company LLC downgraded Electro Scientific Industries from a “buy” rating to a “hold” rating in a research note on Wednesday, October 31st. Two research analysts have rated the stock with a sell rating, four have issued a hold rating and one has assigned a buy rating to the company’s stock. The stock has an average rating of “Hold” and a consensus price target of $28.60.

The company has a debt-to-equity ratio of 0.04, a current ratio of 5.67 and a quick ratio of 4.16. The company has a market cap of $1.01 billion, a P/E ratio of 11.03, a P/E/G ratio of 1.22 and a beta of 0.06.

Electro Scientific Industries (NASDAQ:ESIO) last posted its quarterly earnings data on Tuesday, October 30th. The semiconductor company reported $0.59 EPS for the quarter, beating the consensus estimate of $0.57 by $0.02. Electro Scientific Industries had a return on equity of 45.60% and a net margin of 37.32%. The business had revenue of $85.92 million for the quarter, compared to the consensus estimate of $84.35 million. During the same quarter in the prior year, the business earned $0.39 earnings per share. Electro Scientific Industries’s revenue for the quarter was up 21.1% on a year-over-year basis. Analysts expect that Electro Scientific Industries, Inc. will post 2.01 earnings per share for the current fiscal year.

Institutional investors have recently bought and sold shares of the stock. Swiss National Bank lifted its stake in Electro Scientific Industries by 14.2% in the second quarter. Swiss National Bank now owns 58,000 shares of the semiconductor company’s stock valued at $915,000 after purchasing an additional 7,200 shares during the last quarter. Fortis Advisors LLC purchased a new position in Electro Scientific Industries in the second quarter valued at approximately $123,000. DDD Partners LLC raised its holdings in Electro Scientific Industries by 1.5% during the 2nd quarter. DDD Partners LLC now owns 332,852 shares of the semiconductor company’s stock valued at $5,249,000 after acquiring an additional 4,935 shares during the period. Eqis Capital Management Inc. raised its holdings in Electro Scientific Industries by 164.5% during the 2nd quarter. Eqis Capital Management Inc. now owns 27,902 shares of the semiconductor company’s stock valued at $440,000 after acquiring an additional 17,353 shares during the period. Finally, Renaissance Technologies LLC raised its holdings in Electro Scientific Industries by 3.4% during the 2nd quarter. Renaissance Technologies LLC now owns 1,808,720 shares of the semiconductor company’s stock valued at $28,524,000 after acquiring an additional 60,020 shares during the period. Institutional investors and hedge funds own 93.28% of the company’s stock.

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About Electro Scientific Industries (NASDAQ:ESIO)

Electro Scientific Industries, Inc, together with its subsidiaries, supplies laser-based microfabrication solutions for the microtechnology industry worldwide. The company provides printed circuit board laser drilling products, including laser via drilling systems for electrical interconnect applications that require dimensions to create electrical connections between layers in flexible circuits, high-density circuit boards, and interconnect packages; micro via drilling technology that addresses the changing applications in interconnect packages, multichip modules, and high density interconnect circuit boards; and ultraviolet laser processing systems that employ technology in lasers, optics, and motion control.

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